Multilayer Pcb, 34 Layers, Back Drilling, Laser Blind Holes

YMS PCB from Shenzhen China offer this 34 layers Printed Circuit Board, with the back drill and blind holes, back drill hole size is 0.5mm. The blind hole is 0.1mm drilled by laser machine, stack up is 1+32+1, 1 step HDI board. It’s used in semiconductor test equipment, so the min warp & twist is only 0.5%, much less than the IPC-II standard (0.75%). Board thickness is 5.0mm with 0.3mm holes, the aspect ratio is 17:1, need to do special control in PTH process.

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multilayer pcb 34 layers back drilling laser blind holes4

Pls contact us at [email protected] for your PCB/FPC/PCBA/FPCA/STENCIL/ASSEMBLY service.

Product Parameters

Layer count	34
Material	FR-4 TG180 ITEQ(IT180A)
Board size(mm)	350 X 350
Board size(inch)	13.78 X 13.78
Board thickness	5.0mm
Outer layer copper	35um
Inner layer copper	18um & 35um
Min hole	0.3mm
Min trace width	4mil(0.1mm)
Min trace gap	4mil(0.1mm)
Surface treatment	Immersion gold (ENIG)
Aspect ratio	17 : 1
Application	semiconductor test equipment
Solder mask color	dark green
Silkscreen	white
Standard	IPC-II
Impedance	Yes

Product Features

min warp & twist is only 0.5% with big board size, and the copper weight is not the same for the inner layer, need to do special and high precision control when lamination. Our lamination equipment is from Germany with good quality.

multilayer pcb 34 layers back drilling laser blind holes5

This board request the IPC-III standard, need to meet min 1mil(25um) at hole copper, the customer doesn’t accept repair on the circuit and solder mask.

Pls contact us at [email protected] for your PCB/FPC/PCBA/FPCA/STENCIL/ASSEMBLY service.