30 Layer Laser Pcb Using It-180(Iteq)

It’s 30 layers HDI board with small BGA pads, the BGA is only 10mil with 4mil laser holes on it.
The BGA vias are plugged by non-conductive (resin) then plating over and copper capped.
VIA-IN-HOLE process is very popular in our plant.
We Have Our Laser Drill Machine Inside To Ensure High Quality And On-Time Delivery. We can finish the HDI board in 5-7 days for quick-turn service.

Pls contact us at [email protected] for your PCB/FPC/PCBA/FPCA/STENCIL/ASSEMBLY service.

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30 layer laser pcb using it 180(iteq)4

Product Details

Layer count 30
Material FR-4 TG180 (IT-180A, ITEQ)
Board size(mm) 64 X 56
Board size(inch) 2.52 X 2.205
Board thickness 2.0 mm (80mil)
Stack up: 1+1+1+24+1+1+1
Layer copper Outer layer 1 OZ, inner layer 1OZ & HOZ
Min through hole 0.2mm(8mil)
Min laser hole 0.1mm(4mil)
Min trace width 3mil(0.075mm)
Min trace gap 3mil(0.075mm)
Surface treatment Immersion Gold (ENIG)
Application Mobile phone, telecom communication
Solder mask color black
Silkscreen white
Standard IPC-II
Impedance YES

Product Features

This HDI PCB (circuit board) is made by raw material IT-180A from ITEQ, it’s stable HIGH TG material. It’s made through multiple laser drilling and compression bonding. HDI PCB with blind & buried laser holes is widely used in high-end smartphones and other fields.

30 layer laser pcb using it 180(iteq)5

Pls contact us at [email protected] for your PCB/FPC/PCBA/FPCA/STENCIL/ASSEMBLY service.

Contact Us

Contact Person

Eddi Yan






ECheng Industrial Park,Tongqiao Town,Zhongkai High-Tech Zone,Huizhou,Guangdong,China


Room 402-405, Fu Lin Building, Qiao Tou, Fu Yong, Baoan,Shenzhen,Guangdong,China

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