4 Layers Hybrid & Mixed Dielectric Board,Copper Fill, Silver Fill, Non-Conductive Epoxy Fill With 0.35Mm Bga Pitch

It’s via-in-pad board, VIP technical means the vias are drilled on the BGA pads, we will plug the holes by resin, copper or silver, then do the copper plating and capped, customer can still do the assembly on BGA pads even there are holes under the pads. We are OEM/OMD/EMS PCB/PCBA supplier from Shenzhen, China.

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4 layers hybrid & mixed dielectric boardcopper fill silver fill non conductive epoxy fill with 035mm bga pitch4

Product Parameters

Layers: 4 layers
Board Thickness: 1.6mm (0.0625inch)
Copper weight: 1/1/1/1 OZ
Material: FR-4 HIGH TG (TG150 TG170 TG180 TG250)
Min Holes:0.2mm (8mil)
Minimum Line Width/Clearance:0.13mm/0.13mm (5mil/5mil)
Board Size: 72mm x 51mm
Surface Treatment: ENEPIG
Applications: Medicals Equipment
Impedance Control: Yes
Solder mask color: matt black
Silkscreen color: white

Product Features

PCB using the middle or high TG material. The glass transition temperature of PCB, referred to as TG, indicates the point at which the PCB material will begin to transform. The standard TG of FR-4 material is TG135, middle TG is TG150, high TG means TG170/TG180 or over.
Standard TG normally use in standard 2 layers board, for multilayer board, we advise using middle TG at least TG150. In applications such as automotive, industrial or high-temperature electronics, high TG 170 or 180 will be the best.

4 layers hybrid & mixed dielectric boardcopper fill silver fill non conductive epoxy fill with 035mm bga pitch5