Ic Substrates Circuit Board, Csp,Fc-Csp,Sip,Fmc,Pbga, Pcb/Pcba/Fpc From China Custom

IC substrates serve as the connection between IC chip(s) and the PCB through a conductive network of traces and holes. IC substrates support critical functions including circuit support and protection, heat dissipation, and signal and power distribution.

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ic substrates circuit board cspfc cspsipfmcpbga pcb pcba fpc from china custom4

IC substrates represent the highest level of miniaturization in PCB manufacturing and share many similarities with semiconductor manufacturing.

Pls contact us at [email protected] for your PCB/FPC/PCBA/FPCA/STENCIL/ASSEMBLY service.

Product Details

Layer count	8
Material	FR-4 (M6 from PANANSONIC)
Board size(mm)	164 X 256
Board thickness	1.8 mm
Layer copper	1 OZ
Min through hole	0.2mm(8mil)
Min trace width	3mil(0.075mm)
Min trace gap	3mil(0.075mm)
Surface treatment	Immersion Gold (ENIG)
Application	telecommunications and electronics hardware update
Solder mask color	Blue/green
Silkscreen	white

FC-CSP Features
High I/O Count and Short Interconnects
High layout density
Array type lead-free solder bump & Cu pillar bump
Build-up technology & Stack via
Fine Pattern formation
FC-CSP Specification
Package Size: 3 x 3 mm up to 15 x 15 mm
Line & Space: 15/15 um
Bump Pitch: down to 100 um
ETS, Coreless available
Application: Smartphones, Networks, PC, Servers, consumer electronics

PBGA Features
High circuit density design
Good electrical performance
Good ability for heat dissipation
PBGA Specification
Package Size: 15x15mm up to 27x27mm
Line/Space: 20/20 um
Impedance control for critical signal traces
Application: DTV, Microprocessors/controller/ASICs, Infrastructure application.

Pls contact us at [email protected] for your PCB/FPC/PCBA/FPCA/STENCIL/ASSEMBLY service.